|Company's Full Name:||Lam Research|
|Short Name:||Lam Research|
|Trading Ticker Symbol:||LRCX|
|Headquarter City/Country:||Fremont, California|
|Primary Industry Sector:||Technology|
|Seconday Sub-sector:||Industrial Machinery and Components|
|Main Business Areas:||Technology, Industrial Machinery and Components, Semiconductor Equipment & Materials, NASDAQ|
|Dividend Payments:||Dividend History|
|Current Share Price:||$168.83|
|Previous Year's Closing Price:||$136.17|
|Percentage Price Change (YTD):||23.98%|
|Market Cap:||$25.76 billion|
|52-week Price Range:||$122.64 - $234.88|
|Dividend Per Share:||$3.8|
Lam Research Corporation, incorporated on October 8, 1989, is a supplier of wafer fabrication equipment and services to the semiconductor industry. The Company designs, manufactures, markets, refurbishes and services semiconductor processing systems that are used in the fabrication of integrated circuits (ICs). The Company operates through manufacturing and servicing of wafer processing semiconductor manufacturing equipment segment. The Company's products are designed to enable its customers build a range of devices that are used in a range of electronic products, including cell phones, tablets, computers, storage devices and networking equipment. The Company's customer base includes semiconductor memory, foundry and integrated device manufacturers (IDMs) that make products, such as dynamic random-access memory (DRAM), negative-AND (NAND) memory and logic devices. The Company offers a portfolio of products that are used in several areas of the semiconductor manufacturing process flow, including thin film deposition, plasma etch and single-wafer clean. The Company also offers a range of services, including customer service, spares, upgrades, and refurbishment of its deposition, etch and clean products. The Company also provides refurbished legacy products.
Thin Film Deposition
The Company's thin film deposition systems form a device's sub-microscopic layers of conducting (metal) or insulating (dielectric) materials. The Company's SABRE ECD product family is a platform for copper damascene manufacturing. The Company also offers the SABRE three dimensional (3D) system to address through-silicon via (TSV) and wafer-level packaging (WLP) applications, such as copper pillar, redistribution layers (RDL), high-density fanout, underbump metallization, bumping, and microbumps used in post-TSV processing. The Company's ALTUS systems deposit conformal atomic layer films for tungsten metallization applications. The Company's Multi-Station Sequential Deposition (MSSD) architecture enables a nucleation layer to be formed using Pulsed Nucleation Layer (PNL) technology and bulk chemical vapor deposition (CVD) fill to be performed in the same chamber. PNL, the Company's atomic layer deposition (ALD) technology, is used in the deposition of tungsten nitride films to achieve high step coverage with reduced thickness relative to conventional barrier films. Its applications include tungsten plug and via fill, 3D NAND wordlines, low-stress composite interconnects, and tungsten nitride barrier for via and contact metallization.
The Company's VECTOR family of Plasma-enhanced CVD (PECVD) and ALD systems delivers wafer-to-wafer uniformity and productivity. VECTOR products include specialized systems for logic and memory applications with multiple platform options. VECTOR Express offers a small footprint with over four processing stations. VECTOR Excel is a modular tool for technology nodes where pre and post film deposition treatments are needed. VECTOR Extreme accommodates over 12 processing stations for high-throughput applications. VECTOR Q accommodates over 16 processing stations for depositing multi-stack films. Its applications include deposition of oxides, nitrides and carbides for hardmasks, multiple patterning films, anti-reflective layers, multi-layer stack films, and diffusion barriers. The SPEED high-density plasma CVD (HDP-CVD) products provide void-free gapfill of dielectric films. The SOLA ultraviolet thermal processing (UVTP) product family is used for treatment of backend-of-line (BEOL) low-k dielectric films and front-end-of-line (FEOL) silicon nitride strained films.
The plasma etch is a step that selectively removes materials from the wafer to create the features and patterns of a device. The Company's wet spin clean and plasma-based bevel clean products remove particles, residues and film from the wafer surface before or after adjacent processes. The Kiyo product family delivers solutions for conductor etch applications. Kiyo systems can be configured to perform atomic layer etching (ALE), which delivers atomic-scale variability control to enable wafer processing. Its applications include FinFET gate, fin definition, shallow trench isolation (STI), high-k/metal gate and multiple patterning. The Versys metal product family provides a platform for BEOL metal etch processes. Symmetrical chamber design and independent tuning features provide critical dimension, profile uniformity, and uniformity control for metal hardmask applications.
The Flex product family offers differentiated technologies and application-focused capabilities for a range of dielectric etch applications. Its applications include low-k and ultra low-k dual damascene, self-aligned contacts, capacitor cell, mask open, 3D NAND HAR hole, trench and contact. Based on its conductor etch products, the Syndion TSV etch family provides solutions to address a range of TSV etch applications. The systems support both conventional single-step etch and rapidly alternating process (RAP).
The Company's Single-Wafer Clean process includes wafer cleaning and bevel cleaning. Its wet clean technology products include EOS, Da Vinci, DV-Prime and SP Series. The products deliver process uniformity across the wafer, wafer-to-wafer and lot-to-lot. Its applications include particle, polymer, and residue removal, photoresist removal and wafer backside/bevel cleaning and film removal. Its wet clean systems are also used for multiple wet etch and clean applications for WLP, including silicon substrate thinning, wafer stress relief, underbump metallization etch and photoresist removal. The Coronus plasma-based bevel clean products remove particles, residues and unwanted films from the wafer's edge that can affect the device area. Its applications include post-etch, pre and post-deposition, pre-lithography, and metal film removal to prevent arcing during plasma etch or deposition steps.
The Company competes with Applied Materials, Inc., ASM International, Wonik IPS, Tokyo Electron, Ltd., Screen Holding Co., Ltd. and Semes Co., Ltd.
4650 Cushing Pkwy
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